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Model Number: Silicone
Key Specifications/Special Features:
Silicone thermal pad used for heat dissipation of CPU, mobile phone, LED lighting and most of the high heat power sourceAvailable thickness is from 0.5 to 9.0mmCustomized sizes are acceptedWith double-sided adhesive tape that easily to mount onto any place of the module
Main Export Markets:
AsiaEastern EuropeNorth AmericaWestern Europe
